Chip Module Production

Modular Systems
for the entire
chip module production.

With our modular system solutions, we offer you an end-to-end process chain for the manufacturing and quality assurance of chip modules, starting with lamination, through potting, and on to testing and customization.

MackSmaTec systems provide a high-performance and flexible solution for chip module production. Their modular design allows for easy adaptation to individual requirements. With throughput rates of up to 77,000 modules per hour, they enable maximum productivity.

Integrated inline quality controls ensure consistently high quality at minimal unit costs. Energy-efficient UV-LED technology reduces power consumption and extends the service life of the components. An intuitive touchscreen interface and compact design facilitate integration, operation, and maintenance during ongoing production.

CHIP MODULE MANUFACTURING

Our Solutions
At a Glance

PowerSeal Key Facts at a Glance
  • Up to 40,000 modules per hour
  • Process types: Fill, Dam & Fill, or Fill & Fill
  • Curing via UV LEDs
  • Automatic spooling system for 35 mm module tapes
  • 12-channel and 16-channel dispensing heads
  • High dispensing accuracy
  • Automated in-line quality control

PowerSeal - High-Speed Encapsulation Using UV-LED Technology

The PowerSeal is optimized for the precise and rapid encapsulation of chip modules and, in addition to high performance, offers flexibility in the curing process. In addition to UV-LED technology, UV discharge lamps or heating elements can be integrated as alternatives, depending on process requirements.

The machine is particularly well-suited for high-volume applications where precise control of module geometry and height is essential. Expandable inspection systems enable seamless inline monitoring of the encapsulation quality. The PowerSeal is an ideal solution for the production of electronic health cards with sensitive security chips, where reliable protection through encapsulation material is indispensable.

PowerSeal - High-Speed Encapsulation Using UV-LED Technology
PowerTest Key Facts at a Glance
  • Up to 77,000 chip modules per hour
  • Automatic winding system for 35 mm module tapes
  • Contact-based: up to 128 test heads
  • Contactless: up to 48 test heads
  • Dual Interface & Coil on Module: up to 32 test heads
  • Flexible roll-to-roll system

PowerTest - Versatile Testing and Personalization System

PowerTest is a scalable test system designed for the parallel processing of large quantities of modules—ideal for high-end personalization processes. Its unique feature is its universal testing capability for contact, contactless, and dual-interface modules.

In addition, the platform enables the integration of customized customer solutions, such as through the incorporation of external test software or electrically isolated processing logic—an advantage for security-critical or complex personalization applications.

PowerTest makes it easy to perform the electrical initialization and individual personalization of contactless payment cards with encrypted security modules.

PowerTest - Versatile Testing and Personalization System
GTL700 Key Facts at a Glance
  • Up to 8,000 chip modules per hour
  • Reels for 35 mm module tape, protective film, and adhesive tape
  • 6-station and 10-station tools for die-cutting and laminating
  • for all chip module types and sizes, including Dual Interface
  • Customizable settings for temperature, time, and pressure

GTL700 - Precise Adhesive Tape Lamination

The GTL700 is a specialized system for adhesive tape lamination of module tapes. Its strength lies in the precise preparation of chip modules for the subsequent implantation process. Of particular note are the configurable reel options, which allow for flexible handling of various material types and protective films.

The lamination station’s control system allows for individual adjustment of temperature, time, and pressure—ideal for adapting to different types of adhesive tape and requirements. The GTL700 is used in the production of dual-interface smart cards, where precise lamination processes are crucial for the connection between the contact and antenna units.

GTL700 - Precise Adhesive Tape Lamination
Services & Expertise

Discover even more
about what makes us who we are.

From innovative technologies and smart digital solutions to comprehensive services.
Learn how MackSmaTec creates real added value with its expertise and forward-looking solutions.

Contact us

Interested in a
customized solution?

Our experts will be happy to advise you on suitable systems and support you in implementing efficient production processes.

Your contact person
Yvonne Göpfert Technical Assistant
Sales Card & Passport Systems
+49 36925 929-322
Frequently Asked Questions

Frequently Asked Questions from Our Customers.

Can't find your question? Our representative will answer it confidentially and directly.

Depending on the system used, MackSmaTec processes up to 77,000 chip modules per hour. Integrated inline quality controls ensure consistently high quality even at high throughput rates.

That depends on the production step. The PowerSeal performs high-speed encapsulation using UV-LED technology, for example, for electronic health cards. The PowerTest tests contact, contactless, and dual-interface modules, such as those used in contactless payment cards. Both systems are often used in the same production line.

Both options are possible. GTL700 (lamination), PowerSeal (encapsulation), and PowerTest (testing) can be purchased individually or combined into a complete production line, depending on which process steps you already have in place.