Technology Center

From the first feasibility test
to a working prototype.

Whether it’s a heating wire on a free-form surface, sensors in a textile, or an antenna in a card body: every application presents its own challenges regarding materials, geometry, and processes. At the MackSmaTec Technology Center, we address these questions using actual production equipment—with the same processes that will later be used in your mass production. You’ll receive reliable results, actual prototype parts, and a clear assessment of feasibility.

Overview of Services

An Overview of Our Services

Prototyping & Feasibility

We create a wire layout on a substrate. You determine what has already been decided or where you would like our assistance with the design. You will receive a prototype and a clear feasibility assessment.

Material Expertise

Films, textiles, thermoplastics, and composite materials behave differently when exposed to ultrasound. We draw on our experience in the automotive, medical technology, and secure document industries.

Prototypes & Small-Volume Production

Heatable assemblies, sensor carriers, and contacted structures - including, upon request, contact placement, TC bonding, dispensing, pick-and-place, and optical inspection—all in a single assembly.

Process Development

We determine and document process windows, cycle times, and, where applicable, performance. This forms the basis for your specifications and our plant design.

Features

Our Facilities.
Available Procedures.
Available Modules.

In our showroom and lab, we use the following production systems for wire embedding:

WCEvario3D (for wire embedding on convex and concave surfaces)
WCEvario (for wire embedding on films and textiles)
WCE Large Format (for wire embeddding on large-format substrates)

For contact bonding, we have a TC bonding system as well as manual soldering equipment at our disposal

Upstream and downstream processes are supported by laboratory camera systems, in-house 3D printing, and quality assurance systems.

On the left, you can see sample images from past projects.

Demonstrators

Developed together.
Connected by wire.

Our demonstrators are created in collaboration with partners along the value chain.
Each partner contributes its core expertise; our contribution is wire embedding.
In this way, the components demonstrate what is already possible today with wire on free-form surfaces, textiles, and films.

Automotive | Heating & Sensors
Vehicle Front Panel with Heated Sensors

A 3D-molded front panel with integrated heating wires for heated sensor surfaces. The wires follow the free-form surface with outer radii of up to 2 mm and converge in a common connection area.

Partners: Covestro, Elektrisola, Niebling, Proell
Our contribution: Wire routing on the free-form surface

Automotive | Interiors & Textiles
Heated Center Console

A center console for the vehicle interior with a heated fabric surface. The heating wire is routed directly inside the cover of the replaceable base structure and remains invisible to the user.

Partner: InSuM
Our contribution: Wire installation in the fabric

Electric Mobility | Ladder Structures
Battery Management Circuit

A flexible film with wire-laid conductor tracks for signal routing in battery management. The wires are connected and follow tight radii within a small area.


Partner:
In-house development
Our contribution: Wire routing and contact formation on the film

Your contact person
Michael Bruns Key Account Manager
Assembly Systems & OEM
+49 36925 929-315
Frequently Asked Questions

Frequently Asked Questions from Our Customers.

Can't find your question? Our representative will answer it confidentially and directly.

You’ll have a dedicated point of contact who will guide your project from the initial consultation through to the production plant. Feasibility studies, prototype production, process development, and plant construction are all handled by MackSmaTec. As a result, process data from the technology center is incorporated directly into the design of your plant, and you won’t have to coordinate between multiple partners.

Yes. We also manufacture your wire-bonding components on a contract basis—from pre-production runs to small-batch production, including contact bonding and final testing upon request. This is the standard approach when investing in your own equipment isn’t yet cost-effective given your production volume, or when series production begins before the equipment is installed.

We typically produce prototypes for 2D applications within a few days. For 3D components, the time required depends primarily on the complexity of the component setup. We will coordinate the exact delivery date with you after receiving your request, depending on our current workload.

We begin with a sample package, the contents of which we tailor to your application. This includes a feasibility study, functional prototypes with documentation, and the determined process data. We will provide you with a price in a customized quote as soon as you have described your application to us.

We’ll determine this by conducting an initial layup test on your substrate using your wire at our Technology Center, using the same processes that will later be used in mass production. We process films, textiles, thermoplastics, and composites, and bring experience from the automotive, medical technology, and secure document industries to the table. You’ll receive a clear assessment of feasibility and a real prototype part.

Yes. Based on our experience with numerous projects, we are familiar with many material combinations and know how they behave during the manufacturing process. We’ll work with you to determine which combination is right for your application based on the specifications of your final product. We treat other clients’ projects with the same level of confidentiality as we do yours.

wire embedding is a fast and clean process. The maximum laying speed depends on your component: the wire pattern, radii, geometry, and material pairing determine the pace. During process development, we determine the values for your application and document them as the basis for system design.